this is information on a product in full production. november 2013 docid15657 rev 4 1/10 PEP01-5841 power over ethernet power supply protection datasheet - production data features ? peak pulse power: up to 2.7 kw (8/20 s) ? stand-off voltage: 58 v ? 4 unidirectional trans ils? and 4 decoupling capacitances ? low clamping voltage: 100 v ? low leakage current: ? 0.2 a at 25 c ? 1 a at 85 c ? operating t j max: 150 c ? jedec registered package outline complies with the following standards ? iec61000-4-2 level 4 ? 15 kv (air discharge) ? 8 kv (contact discharge) ? iec61000-4-5 level 2 ? 1 kv 42 ? ? ieee 802.3af-2003 ? ieee 802.3at-2008 description the PEP01-5841 has been designed to protect power over ethernet pse equipment against line overvoltages. it embeds 4 decoupling capacitors to stabilize power supplies. it is compatible with ieee 802.3af-2003 and ieee 802.3at-2008 requirements and it allows poe based systems to be protected against both electrical overstress (eos) and electrostatic discharges (esd) according to iec61000-4-5 and iec61000-4-2. the low clamping voltage (100 v) makes it compatible with pmos and pse controller technologies. developed in planar technology, it provides high reliability level. packaged in so-8, th is minimizes pcb consumption (footprint in accordance with the ipc 7531 standard). figure 1. functional diagram tm: transil is a trademar k of stmicroelectronics so-8 package PEP01-5841 ps1 1 ps2 4 ps3 5 ps4 8 gnd 2-3-6-7 --- all gnd pins must be connected to gnd www.st.com
characteristics PEP01-5841 2/10 docid15657 rev 4 1 characteristics figure 2. electrical charac teristics - definitions (t amb = 25 c) table 1. absolute ratings (t amb = 25 c) symbol parameter value unit v pp peak pulse voltage (iec61000-4-2 contact discharge) 30 kv p pp peak pulse power dissipation t j initial = t amb 2700 w t stg storage temperature range -65 to + 150 c t j operating junction temperature range -55 to + 150 c t l maximum lead temperature for soldering during 10 s. 260 c table 2. electrical char acteristics - values (t amb = 25 c) type i rm max @ v rm v br @i r (1) 1. pulse test: t p < 50 ms 8/20 s v cl @i pp r d (2) 2. to calculate maximum clamping voltage at ot her surge level, use the following formula: v clmax = r d x i pp + v brmax c ? t (3) 3. to calculate v br versus junction temperature, use the following formula: v br @ tj = v br @ 25 c x (1 + ? t x (t j - 25)) 25 c 85 c min. typ. max. max. typ. max. a a v v ma v a ? pf 10 -4 c PEP01-5841 0.2 1 58 64.4 67.8 71.2 1 100 24 1.2 55 10.4 symbol parameter v = breakdown voltage i = leakage current @ v v = stand-off voltage v = clamping voltage i = peak pulse current br rm rm rm cl pp v i v cl v br v rm i f v f i rm i pp slope: 1/r d t voltage temperature coefficient = c capacitance = r = dynamic resistance d
docid15657 rev 4 3/10 PEP01-5841 characteristics 10 figure 3. pulse waveform 100 50 % i pp t r 0 t repetitive peak pulse current t r = rise time (s) t p = pulse duration time (s) t p figure 4. peak power dissipation versus initial junction temperature figure 5. peak pulse power versus exponential pulse duration (t j initial = 25 c) 0 10 20 30 40 50 60 70 80 90 100 110 0 25 50 75 100 125 150 175 t j ( tj (c) ppp[tj initial] / ppp [tj initial = 25c] 0.1 1.0 10.0 100.0 1.0e-03 1.0e-02 1.0e-01 1.0e+00 1.0e+01 p pp (kw) t j initial = 25 c t p (ms) figure 6. clamping voltage versus peak pulse current (exponential waveform, maximum values) figure 7. capacitance versus voltage (typical values) 0.1 1.0 10.0 100.0 70 80 90 100 8/20 s t j initial = 25 c i pp (a) v cl (v) 10 100 44 46 48 50 52 54 56 58 v r (v) c(pf) f=1 mhz v osc =30 mv rms t j = 25 c
characteristics PEP01-5841 4/10 docid15657 rev 4 figure 10. leakage current versus junction temperature (typical values) figure 8. peak forward voltage drop versus peak forward current (typical values) figure 9. relative variation of thermal impedance junction to ambient versus pulse duration 1.0e-02 1.0e-01 1.0e+00 1.0e+01 0.0 0.5 1.0 1.5 2.0 2.5 3.0 i fm (a) v fm (v) t j = 125 c t j = 25 c 0.01 0.10 1.00 1.0e-03 1.0e-02 1.0e-01 1.0e+00 1.0e+01 1.0e+02 1.0e+03 z th(j-a) / r th(j-a) with recommended pad layout t p (s) (printed ciruit board fr4, s = 1 cm ) cu 2 1.e-02 1.e-01 1.e+00 1.e+01 1.e+02 1.e+03 1.e+04 25 50 75 100 125 150 i r (na) t j (c) v r =v rm
docid15657 rev 4 5/10 PEP01-5841 application 10 2 application figure 11. typical application circuit with pmos integrated in pse controller 48v poe controller + - i2c tx rx tx rx tx rx tx rx c o v1 pep0 1 - 5 8 4 1 48v poe controller + - i2c tx rx tx rx tx rx tx rx om v1 ps1 ps2 ps3 ps4 pep0 1 - 5 8 4 1 pep0 1 - 5 8 4 1 gnd
application PEP01-5841 6/10 docid15657 rev 4 figure 12. typical application circuit with external pmos figure 11 and figure 12 show typical application schematics of poe network. power sourcing equipment ( pse) allows communicati on and power sourcing for several power devices (pd). the number of wa ys is generally a multiple of 4, this optimizes the pep01- 5841 for track layout and crosstalk, as well as pcb surface occupation. this protection device has been studied to co mply with the latest ieee 802.3 af-2003 require ments and to withstand the surge defined in the iec 61000-4-5 level 2 requirements. - 48v PEP01-5841 pse controller - 48v PEP01-5841 pse controller
docid15657 rev 4 7/10 PEP01-5841 package information 10 3 package information ? case: jedec so-8 molded plastic over planar junction ? terminals: solder plated, solderable according to mil-std-750, method 2026 ? flammability: epoxy is rated ul94v-0 ? rohs package in order to meet environmental requirements, st offers these devices in different grades of ecopack ? packages, depending on their level of environmental compliance. ecopack ? specifications, grade definitions a nd product status are available at: www.st.com . ecopack ? is an st trademark. figure 13. so-8 dime nsion definitions table 3. so-8 dimension values ref. dimensions millimeters inches min. typ. max. min. typ. max. a - - 1.75 - - 0.069 a1 0.1 - 0.25 0.004 - 0.010 a2 1.25 - - 0.049 - - b 0.28 - 0.48 0.011 - 0.019 c 0.17 - 0.23 0.007 - 0.009 d 4.80 4.90 5.00 0.189 0.193 0.197 e 5.80 6.00 6.20 0.228 0.236 0.244 e1 3.80 3.90 4.00 0.150 0.154 0.157 e - 1.27 - - 0.050 - h 0.25 - 0.50 0.010 - 0.020 l 0.40 - 1.27 0.016 - 0.050 l1 - 1.04 - - 0.041 - k 0 - 8 0 - 8 ppp - - 0.10 - - 0.004 e1 d 8 4 1 5 e e a a2 b a1 ppp c c k h x 45 l l1 seating plane c
package information PEP01-5841 8/10 docid15657 rev 4 figure 16. marking figure 14. footprint recommendation dimensions in mm (inches) figure 15. footprint recommendation for improved clearance dimensions in mm (inches) 6.8 (0.268) 4.2 (0.165) 1.27 (0.050) 0.6 (0.024) 6.8 (0.268) 4.2 (0.165) 1.27 (0.050) 0.5 (0.0 ) 196 a xxxx: marking zz: manufacturing location y: year ww: week z z y w w x x x x x x pin 1 ? z z z z y y w w w w x x x x x x x x
docid15657 rev 4 9/10 PEP01-5841 ordering information 10 4 ordering information figure 17. ordering information scheme 5 revision history table 4. ordering information order code marking package weight base qty delivery mode PEP01-5841 58e1 so-8 78 mg 2000 tape and reel pep 01 - 58 4 1 power over ethernet protection 1 = so-8 packaging number of power supply lines to be protected 58 = 58 v stand off voltage version table 5. document revision history date revision changes 06-may-2009 1 initial release. 14-may-2009 2 standards compliance updated. 17-jan-2013 3 added note on gnd pins in figure 1 and added figure 15 . 13-nov-2013 4 updated level 4 to level 2 under figure 12 .
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